TSMC invests in US advanced packaging for AI chips

TSMC's $100 billion investment in the US, the largest foreign investment in US history, will establish advanced packaging facilities in Arizona, crucial for AI chip production. This investment by the world's leading chip manufacturer aims to bolster the US's AI capabilities by bringing advanced packaging technology, like TSMC's CoWoS, closer to chip fabrication. This technology allows for faster data transmission and lower energy consumption. Advanced packaging, which places multiple chips closer together, is vital for AI applications. This move strengthens the US's position in the AI race, reducing supply chain risks and potentially challenging China's dominance in the field.