Spry Technocon and SITECH India Showcase Trimble's Connected Construction Tech at bauma CONEXPO INDIA 2026

Spry Technocon and SITECH India showcased Trimble's connected construction technologies at bauma CONEXPO INDIA 2026, held September 15-18 in Greater Noida, highlighting unified digital workflows for infrastructure projects. The demonstrations align with NHAI's August directive mandating automated machine-aided construction on major highways, positioning the dealers as key integration partners. They displayed systems like Grade Control and Earthworks, currently deployed across four road projects in Madhya Pradesh, Andhra Pradesh, Maharashtra, and Tamil Nadu. Trimble's AI-MC enabled compaction solution, engineered in India, was a booth highlight. The partners are supported by Trimble's Chennai R&D center, offering localized service and training to contractors.