Apple's M5 Pro chip may separate CPU and GPU for improved performance

9to5mac.com

Apple's upcoming M5 Pro chip may feature a new design that separates the CPU and GPU, differing from the traditional integrated System-on-a-Chip (SoC) approach. This change aims to enhance performance and improve production yields. The M5 Pro will utilize TSMC's advanced SoIC-mH packaging, which enhances thermal performance and reduces chip failures. This method will be applied to the M5 Pro, Max, and Ultra variants, with mass production expected to begin in 2025. Additionally, the M5 Pro chips are set to power Apple's Private Cloud Compute servers, which will support AI applications. This marks a shift in how Apple designs its chips for both consumer devices and server infrastructure.


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